(1)General description

  1.Compating with MWT, EWT, IBC and other back-contact  solar module technologies.
  2.Compating with PERC, black silicon, HIT, etc. solar cell          technologies.
  3.Adapting to the SMD automatic Assembly                packagingproduction line
  4.Reducing packaging   loss.
  5.Customizing   structure and pattern.
  6.Possessing several   patents of invention


(2)Technical specification: Click download