Interfoil-D
TYPE: Interfoil-D
|
No. |
Testing items |
Performance |
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|
1 |
Total Thickness |
620 um |
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|
2 |
structure |
Copper layer |
35 um |
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|
EVA |
300 um |
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|
Backsheet |
FFC(EVA side) |
12 um |
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|
PET |
285 um |
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|
FFC（Air side） |
13 um |
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|
3 |
Thickness deviation |
±5% |
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|
4 |
Position accuracy of circuit diagram |
＜±0.5 mm |
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|
5 |
Position accuracy of holes |
＜±0.5 mm |
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|
6 |
Backsheet |
Tensile strength |
MD |
≥120N/mm2 GB/T13542.2-2009 |
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TD |
≥120N/mm2 GB/T13542.2-2009 |
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|
Elongation at break |
MD |
≥100% GB/T13542.2-2009 |
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|
TD |
≥90% GB/T13542.2-2009 |
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|
Heat shrinkage@150℃ 30min |
MD |
≤1 % GB/T13542.2-2009 |
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|
TD |
≤1 % GB/T13542.2-2009 |
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|
Coating adhesion |
0 grade GB/T9286-1998 |
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|
Peeling strength with EVA (Initial) |
≥45 N/cm GB/T2790-1995 |
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|
Peeling strength with EVA (85℃*85%RH,1000h) |
≥40 N/cm GB/T2790-1995 |
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|
Partial discharge |
≥1500 v IEC60664-1-2007 |
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|
Breakdown voltage |
≥18 Kv GB/T13542.2-2009 |
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|
Moisture vapor transmission rate |
≤2.5 g/m2﹒d GB/T26253-2010 |
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|
Damp-heat Testing(85℃*85%RH,2000h) |
No delamination , no bubble,Δb≤2 IEC61215-2005 |
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|
UV pretreatment(60kWh/m2) |
No delamination , no bubble or fold,Δb≤2 IEC61215-2005 |
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Boiling water treatment(boil for 24h) |
Visually inspect |
No delamination , no bubble or fold, no peeling or powdering GB/T17748-2008 |
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|
Coating adhesion |
0 grade GB/T9286-1998 |
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|
Fluor content |
fluor free |
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Note: The backsheet is customized, and the above data is for reference only. |
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