Interfoil-F

Short Description:

Interfoil-F is a conductive core board for MWT modules. The punched holes and electric circuit are tailormade based on the design of the customer.


Product Detail

Product Tags

TYPE: Interfoil-F

No.


Testing items


Performance

1

Total Thickness

195±10 um

2

Back-contact circuit structure

EVA layer

30 um

PET layer

100 um

EVA layer

30 um

Copper circuit

35 um

3

size

customized

4

Weight

492 ±5 g/m2

5

 

Thermal shrinkage@145℃ 30min

MD

<2 ‰

TD

<1 ‰

6

 

180° Interlaminar peeling Strength

4 N/cm

7

Position accuracy of positioning points

±0.5 mm

8

Position accuracy of holes

±0.5 mm

9

Tensile Strength

>150 M pa

10

Temperature for lamination

90-165 ℃

11

Breakdown voltage

22 Kv IEC60664-1

12

Color

 

Black/White

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